TY - GEN
T1 - ZR-based metallic glass as a novel MEMS bonding material
AU - Rin, Ikusei
AU - Froemel, J.
AU - Sharma, P.
AU - Inoue, A.
AU - Esashi, Masayoshi
AU - Gessner, T.
PY - 2011
Y1 - 2011
N2 - In this study, for the first time we successfully bonded Si substrates with sputtered Zr-Al-Cu-Ni metallic glassy material. The surface pre-treatment with formic acid vapor plays a remarkable function for oxides removal before bonding. Metallic glasses have fundamentally glassy structure and exhibit a Newtonian viscous flow in the supercooled liquid region. The polymer-like plastic fluidity performs superior wettability which improves interfacial integrity. This paper introduces a unique functional material and reveals its high potential for MEMS bonding application.
AB - In this study, for the first time we successfully bonded Si substrates with sputtered Zr-Al-Cu-Ni metallic glassy material. The surface pre-treatment with formic acid vapor plays a remarkable function for oxides removal before bonding. Metallic glasses have fundamentally glassy structure and exhibit a Newtonian viscous flow in the supercooled liquid region. The polymer-like plastic fluidity performs superior wettability which improves interfacial integrity. This paper introduces a unique functional material and reveals its high potential for MEMS bonding application.
UR - http://www.scopus.com/inward/record.url?scp=79953778082&partnerID=8YFLogxK
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U2 - 10.1109/MEMSYS.2011.5734473
DO - 10.1109/MEMSYS.2011.5734473
M3 - Conference contribution
AN - SCOPUS:79953778082
SN - 9781424496327
T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
SP - 509
EP - 512
BT - 2011 IEEE 24th International Conference on Micro Electro Mechanical Systems, MEMS 2011
T2 - 24th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2011
Y2 - 23 January 2011 through 27 January 2011
ER -