Wetting characteristics of Sn-Ag-Cu solder on Pd-based metallic glass

Hiroshi Nishikawa, Krit WongPiromsarn, Hiroya Abe, Tadashi Takemoto, Mikio Fukuhara, Takeshi Wada, Akihisa Inoue

研究成果: Article査読

15 被引用数 (Scopus)

抄録

A feasibility study has been conducted to determine whether soldering process can be used for the joining of metallic glasses. The mechanical properties of metallic glasses are extremely attractive compared with conventional crystalline materials. In order to adopt bulk metallic glasses in a broader range of engineering applications, it is very important to establish appropriate joining processes of metallic glasses. During the joint of metallic glass, the most serious issue is the reformation of glassy phase at the high temperature area. Therefore, to avoid the recrystallization of glassy phase, the soldering process has been investigated to join metallic glasses. In this study, the spread test was mainly performed at 523 K for 60 s. Results showed that the Sn-3.0 mass%Ag-0.5 mass%Cu solder deposited on Pd-based metallic glass had better wetting characteristics than the Sn-57 mass%Bi and Sn-51 mass%In solders. The microstructure at the interface between Sn-3.0Ag-0.5Cu solder and Pd-based metallic glass was analyzed by scanning electron microscopy. It was clear that the intermetallic compound, PdSn4 phase, was formed at the interface.

本文言語English
ページ(範囲)124-127
ページ数4
ジャーナルMaterials Science and Engineering B: Solid-State Materials for Advanced Technology
148
1-3
DOI
出版ステータスPublished - 2008 2月 25

ASJC Scopus subject areas

  • 材料科学(全般)
  • 凝縮系物理学
  • 材料力学
  • 機械工学

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