Wafer-to-wafer selective flip-chip transfer by sticky silicone bonding and laser debonding for rapid and easy integration test

Shuji Tanaka, Masaki Yoshida, Hideki Hirano, Toshihiro Somekawa, Masayuki Fujita, Masayoshi Esashi

研究成果: Conference contribution

8 被引用数 (Scopus)

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Chemical Compounds

Engineering & Materials Science

Physics & Astronomy