Wafer-level hermetic packaging technology for MEMS using anodically-bondable LTCC wafer

Shuji Tanaka, Sakae Matsuzaki, Mamoru Mohri, Atsushi Okada, Hideyuki Fukushi, Masayoshi Esashi

研究成果: Conference contribution

25 被引用数 (Scopus)

抄録

This paper describes a versatile and reliable wafer-level hermetic packaging technology using an anodically-bondable low temperature cofired ceramic (LTCC) wafer, in which electrical feedthroughs and passive components can be embedded. The hermeticity of vacuum-sealed cavities was confirmed after 3000 cycles of heat shock (-40 °C/+150 °C, 30 min/30 min) by diaphragm method. The width of seal rings necessary for hermetic sealing of saw-diced chips is 0.1 mm or less. Electrical connection between MEMS on a Si wafer and feedthroughs in the LTCC wafer was established using Sn-containing met al stack simultaneously with anodic bonding. The developed wafer-level hermetic packaging technology is ready for practical applications.

本文言語English
ホスト出版物のタイトル2011 IEEE 24th International Conference on Micro Electro Mechanical Systems, MEMS 2011
ページ376-379
ページ数4
DOI
出版ステータスPublished - 2011 4 13
イベント24th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2011 - Cancun, Mexico
継続期間: 2011 1 232011 1 27

出版物シリーズ

名前Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
ISSN(印刷版)1084-6999

Other

Other24th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2011
CountryMexico
CityCancun
Period11/1/2311/1/27

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Mechanical Engineering
  • Electrical and Electronic Engineering

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