Wafer level encapsulation of microsystems using glass frit bonding

R. Knechtel; M. Wiemer; Joerg Eckhardt Froemel

doi:10.1007/s00542-005-0036-4

Wafer level encapsulation of microsystems using glass frit bonding

R. Knechtel, M. Wiemer, Joerg Eckhardt Froemel

研究成果: Article › 査読

50 被引用数 (Scopus)

抄録

This paper gives an introduction to glass frit wafer bonding, which is an universally useable technology for encapsulation of microsystems, especially surface micromechanical sensors on wafer level. After a process description, some mechanical as well as electrical characteristics of glass frit bonded wafers are discussed and applications are shown.

本文言語	English
ページ（範囲）	468-472
ページ数	5
ジャーナル	Microsystem Technologies
巻	12
号	5
DOI	https://doi.org/10.1007/s00542-005-0036-4
出版ステータス	Published - 2006 4 1
外部発表	はい

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Hardware and Architecture
Electrical and Electronic Engineering

文献へのアクセス

10.1007/s00542-005-0036-4

フィンガープリント「Wafer level encapsulation of microsystems using glass frit bonding」の研究トピックを掘り下げます。これらがまとまってユニークなフィンガープリントを構成します。

引用スタイル

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