This paper gives an introduction to glass frit wafer bonding, which is an universally useable technology for encapsulation of microsystems, especially surface micromechanical sensors on wafer level. After a process description, some mechanical as well as electrical characteristics of glass frit bonded wafers are discussed and applications are shown.
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Hardware and Architecture
- Electrical and Electronic Engineering