Wafer level encapsulation of microsystems using glass frit bonding

R. Knechtel, M. Wiemer, Joerg Eckhardt Froemel

研究成果: Article査読

50 被引用数 (Scopus)

抄録

This paper gives an introduction to glass frit wafer bonding, which is an universally useable technology for encapsulation of microsystems, especially surface micromechanical sensors on wafer level. After a process description, some mechanical as well as electrical characteristics of glass frit bonded wafers are discussed and applications are shown.

本文言語English
ページ(範囲)468-472
ページ数5
ジャーナルMicrosystem Technologies
12
5
DOI
出版ステータスPublished - 2006 4 1
外部発表はい

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Hardware and Architecture
  • Electrical and Electronic Engineering

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