Wafer bonding of polycrystalline spinel with LiNbO3/LiTaO 3 for temperature compensation of RF surface acoustic wave devices

Keiichiro Geshi, Kanji Teraoka, Yutaka Tsuji, Akihito Fujii, Yoshihiro Imagawa, Shigeru Nakayama, Ken Ya Hashimoto, Shuji Tanaka, Kentaro Totsu, Hideki Takagi

研究成果: Article査読

1 被引用数 (Scopus)

抄録

This paper proposes use of polycrystalline spinel for the temperature compensation of radio frequency (RF) surface acoustic wave (SAW) devices. Spinel can be bonded with LiTaO3 (LT) and LiNbO3 (LN) wafers by using adhesive and direct bonding techniques. A series of RF SAW resonators were fabricated on the LT(LN)/spinel structure, and their performance, including the temperature coefficient of frequency (TCF), was measured. For comparison, SAW resonators employing Si and sapphire in place of spinel were also fabricated. The result indicated that the polycrystalline spinel offers TCF improvement better than other materials.

本文言語English
ページ(範囲)116-119
ページ数4
ジャーナルSEI Technical Review
75
出版ステータスPublished - 2012 10 1

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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