Wafer bonding of polycrystalline spinel with LiNbO3/LiTaO 3 for temperature compensation of RF surface acoustic wave devices

K. Geshi, K. Teraoka, S. Kinoshita, M. Nakayama, Y. Imagawa, S. Nakayama, K. Hashimoto, S. Tanaka, K. Totsu, H. Takagi

研究成果: Conference contribution

6 被引用数 (Scopus)

抄録

This paper proposes use of polycrystalline spinel for the temperature compensation of RF surface acoustic wave (SAW) devices. Spinel can be bonded with LiTaO3 (LT) and LiNbO3 (LN) wafers by using adhesive and direct bonding techniques. A series of RF SAW resonators were fabricated on the LT(LN)/spinel structure, and their performance including the temperature coefficient of frequency (TCF) was measured. For comparison, SAW resonators employing Si, sapphire and alumina in place of spinel were also fabricated. The result indicated that the polycrystalline spinel offers TCF improvement better than the other materials.

本文言語English
ホスト出版物のタイトル2012 IEEE International Ultrasonics Symposium, IUS 2012
ページ2726-2729
ページ数4
DOI
出版ステータスPublished - 2012 12 1
イベント2012 IEEE International Ultrasonics Symposium, IUS 2012 - Dresden, Germany
継続期間: 2012 10 72012 10 10

出版物シリーズ

名前IEEE International Ultrasonics Symposium, IUS
ISSN(印刷版)1948-5719
ISSN(電子版)1948-5727

Other

Other2012 IEEE International Ultrasonics Symposium, IUS 2012
CountryGermany
CityDresden
Period12/10/712/10/10

ASJC Scopus subject areas

  • Acoustics and Ultrasonics

フィンガープリント 「Wafer bonding of polycrystalline spinel with LiNbO<sub>3</sub>/LiTaO <sub>3</sub> for temperature compensation of RF surface acoustic wave devices」の研究トピックを掘り下げます。これらがまとまってユニークなフィンガープリントを構成します。

引用スタイル