Vertical integration technologies for optical transmissive 3-D microscanner based on glass microlenses

S. Bargiel, C. Jia, M. Baranski, J. Frömel, N. Passilly, C. Gorecki, M. Wiemer

研究成果: Conference article査読

6 被引用数 (Scopus)

抄録

This paper describes crucial technological aspects of development of an optical, transmissive, vertically-integrated 3-D microscanner: chip-level bonding of micro-optical components and wafer-level anodic bonding of deeply structurized substrates. We present two methods of hybrid integration of glass microlenses with fragile movable parts of silicon microactuators, based on glass frit bonding or direct thermal bonding, that have been experimentally validated in terms of bonding strength, anodic bonding compatibility and change of optical performance of microlens. We also demonstrate the 3D stacking technology, based on sequential multi-level anodic bonding, successfully tested with deeply structurized silicon/glass wafers. Presented methods are of general importance for vertically integrated M(O)EMS Si/glass devices.

本文言語English
ページ(範囲)1133-1136
ページ数4
ジャーナルProcedia Engineering
47
DOI
出版ステータスPublished - 2012
外部発表はい
イベント26th European Conference on Solid-State Transducers, EUROSENSOR 2012 - Krakow, Poland
継続期間: 2012 9月 92012 9月 12

ASJC Scopus subject areas

  • 工学(全般)

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