TY - JOUR
T1 - Vertical integration technologies for optical transmissive 3-D microscanner based on glass microlenses
AU - Bargiel, S.
AU - Jia, C.
AU - Baranski, M.
AU - Frömel, J.
AU - Passilly, N.
AU - Gorecki, C.
AU - Wiemer, M.
PY - 2012
Y1 - 2012
N2 - This paper describes crucial technological aspects of development of an optical, transmissive, vertically-integrated 3-D microscanner: chip-level bonding of micro-optical components and wafer-level anodic bonding of deeply structurized substrates. We present two methods of hybrid integration of glass microlenses with fragile movable parts of silicon microactuators, based on glass frit bonding or direct thermal bonding, that have been experimentally validated in terms of bonding strength, anodic bonding compatibility and change of optical performance of microlens. We also demonstrate the 3D stacking technology, based on sequential multi-level anodic bonding, successfully tested with deeply structurized silicon/glass wafers. Presented methods are of general importance for vertically integrated M(O)EMS Si/glass devices.
AB - This paper describes crucial technological aspects of development of an optical, transmissive, vertically-integrated 3-D microscanner: chip-level bonding of micro-optical components and wafer-level anodic bonding of deeply structurized substrates. We present two methods of hybrid integration of glass microlenses with fragile movable parts of silicon microactuators, based on glass frit bonding or direct thermal bonding, that have been experimentally validated in terms of bonding strength, anodic bonding compatibility and change of optical performance of microlens. We also demonstrate the 3D stacking technology, based on sequential multi-level anodic bonding, successfully tested with deeply structurized silicon/glass wafers. Presented methods are of general importance for vertically integrated M(O)EMS Si/glass devices.
KW - Assembly technology
KW - Bonding
KW - Glass microlens
KW - Moems
KW - Optical microscanner
KW - Vertical integration
UR - http://www.scopus.com/inward/record.url?scp=84887090119&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84887090119&partnerID=8YFLogxK
U2 - 10.1016/j.proeng.2012.09.351
DO - 10.1016/j.proeng.2012.09.351
M3 - Conference article
AN - SCOPUS:84887090119
VL - 47
SP - 1133
EP - 1136
JO - Procedia Engineering
JF - Procedia Engineering
SN - 1877-7058
T2 - 26th European Conference on Solid-State Transducers, EUROSENSOR 2012
Y2 - 9 September 2012 through 12 September 2012
ER -