Vertical integration of array-type miniature interferometers at wafer level by using multistack anodic bonding

Wei Shan Wang, Maik Wiemer, Joerg Froemel, Tom Enderlein, Thomas Gessner, Justine Lullin, Sylwester Bargiel, Nicolas Passilly, Jorge Albero, Christophe Gorecki

研究成果: Conference contribution

2 被引用数 (Scopus)

抄録

In this work, vertical integration of miniaturized array-type Mirau interferometers at wafer level by using multi-stack anodic bonding is presented. Mirau interferometer is suitable for MEMS metrology and for medical imaging according to its vertical-, lateral- resolutions and working distances. Miniaturized Mirau interferometer can be a promising candidate as a key component of an optical coherence tomography (OCT) system. The miniaturized array-type interferometer consists of a microlens doublet, a Si-based MEMS Z scanner, a spacer for focus-adjustment and a beam splitter. Therefore, bonding technologies which are suitable for heterogeneous substrates are of high interest and necessary for the integration of MEMS/MOEMS devices. Multi-stack anodic bonding, which meets the optical and mechanical requirements of the MOEMS device, is adopted to integrate the array-type interferometers. First, the spacer and the beam splitter are bonded, followed by bonding of the MEMS Z scanner. In the meanwhile, two microlenses, which are composed of Si and glass wafers, are anodically bonded to form a microlens doublet. Then, the microlens doublet is aligned and bonded with the scanner/spacer/beam splitter stack. The bonded array-type interferometer is a 7- wafer stack and the thickness is approximately 5mm. To separate such a thick wafer stack with various substrates, 2-step laser cutting is used to dice the bonded stack into Mirau chips. To simplify fabrication process of each component, electrical connections are created at the last step by mounting a Mirau chip onto a flip chip PCB instead of through wafer vias. Stability of Au/Ti films on the MEMS Z scanner after anodic bonding, laser cutting and flip chip bonding are discussed as well.

本文言語English
ホスト出版物のタイトルOptical Micro- and Nanometrology VI
編集者Wolfgang Osten, Christophe Gorecki, Anand Krishna Asundi
出版社SPIE
ISBN(電子版)9781510601352
DOI
出版ステータスPublished - 2016
外部発表はい
イベントOptical Micro- and Nanometrology VI - Brussels, Belgium
継続期間: 2016 4月 52016 4月 7

出版物シリーズ

名前Proceedings of SPIE - The International Society for Optical Engineering
9890
ISSN(印刷版)0277-786X
ISSN(電子版)1996-756X

Other

OtherOptical Micro- and Nanometrology VI
国/地域Belgium
CityBrussels
Period16/4/516/4/7

ASJC Scopus subject areas

  • 電子材料、光学材料、および磁性材料
  • 凝縮系物理学
  • コンピュータ サイエンスの応用
  • 応用数学
  • 電子工学および電気工学

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