Vertical-cavity surface-emitting laser chip bonding by surface-tension-driven self-assembly for optoelectronic heterogeneous integration

Yuka Ito, Takafumi Fukushima, Hisashi Kino, Kang Wook Lee, Koji Choki, Tetsu Tanaka, Mitsumasa Koyanagi

研究成果: Article査読

8 被引用数 (Scopus)

抄録

Twelve-channel vertical-cavity surface-emitting laser (12-ch VCSEL) chips are heterogeneously self-assembled on Si and glass wafers using water surface tension as a driving force. The VCSEL chips have a high length-to-width aspect ratio, that is, 3 mm long and 0.35 mm wide. The VCSEL chips are precisely self-assembled with alignment accuracies within 2 μm even when they are manually placed on liquid droplets provided on the host substrate. After the self-assembly of the VCSEL chips and the subsequent thermal compression, the chips successfully emit 850 nm light and exhibit no degradation of their current-voltage (I-V) characteristics.

本文言語English
論文番号030206
ジャーナルJapanese journal of applied physics
54
3
DOI
出版ステータスPublished - 2015 3 1

ASJC Scopus subject areas

  • 工学(全般)
  • 物理学および天文学(全般)

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