TY - JOUR
T1 - Vertical-cavity surface-emitting laser and its applications for optical interconnection and switch
AU - Kosaka, Hideo
PY - 1998/3
Y1 - 1998/3
N2 - A two-dimensional (2D) optical-parallel interconnection module was developed using vertical-cavity surface-emitting lasers (VCSELs) which have a low threshold, high temperature tolerance and uniform and effective fiber coupling characteristics. The 8×2 - arrayed VCSEL was self-aligned to a developed plastic-molded receptacle-type package using flip-chip solder bonding technique and a developed ball-guide die bonding technique. The module exhibited high data throughput of 1 Gb/s at temperatures up to 70°C, high optical coupling efficiency of 85.8±2.93% and high mechanical durability of less than 0.26 dB for 100 times of manual push/pull matings with a developed multifiber push-on (MPO) - type 2D fiber connector. As an application of the high-density, high-throughput an optical parallel interconnections, optical full crossbar switch with a simple architecture and fabricated plastic-molded optical crossbar connectors was demonstrated.
AB - A two-dimensional (2D) optical-parallel interconnection module was developed using vertical-cavity surface-emitting lasers (VCSELs) which have a low threshold, high temperature tolerance and uniform and effective fiber coupling characteristics. The 8×2 - arrayed VCSEL was self-aligned to a developed plastic-molded receptacle-type package using flip-chip solder bonding technique and a developed ball-guide die bonding technique. The module exhibited high data throughput of 1 Gb/s at temperatures up to 70°C, high optical coupling efficiency of 85.8±2.93% and high mechanical durability of less than 0.26 dB for 100 times of manual push/pull matings with a developed multifiber push-on (MPO) - type 2D fiber connector. As an application of the high-density, high-throughput an optical parallel interconnections, optical full crossbar switch with a simple architecture and fabricated plastic-molded optical crossbar connectors was demonstrated.
KW - Optical fiber coupling
KW - Optical interconnections
KW - Parallel processing
KW - Plastic packaging
KW - Semiconductor device packaging
KW - Semiconductor laser arrays
KW - Surface mounting
KW - Surface-emitting lasers
UR - http://www.scopus.com/inward/record.url?scp=0008601742&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=0008601742&partnerID=8YFLogxK
U2 - 10.1143/jjap.37.1394
DO - 10.1143/jjap.37.1394
M3 - Article
AN - SCOPUS:0008601742
VL - 37
SP - 1394
EP - 1399
JO - Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes
JF - Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes
SN - 0021-4922
IS - 3 SUPPL. B
ER -