Versatile wafer-level hermetic packaging technology using anodically-bondable LTCC wafer with compliant porous gold bumps spontaneously formed in wet-etched cavities

Shuji Tanaka, Mamoru Mohri, Atsushi Okada, Hideyuki Fukushi, Masayoshi Esashi

研究成果: Conference contribution

12 被引用数 (Scopus)

抄録

This paper reports simple and versatile technology for hermetically capping MEMS with a wet-etched LTCC (low temperature cofired ceramic) wafer by standard anodic bonding process, in which the MEMS and Au vias in the LTCC wafer are electrically connected by porous Au bumps. The porous Au bump is spontaneously formed from a part of the Au via by wet-etching the LTCC wafer, because glass-based filler in the Au via is etched away and leaves pores. Excellent compliance of the porous Au bump absorbs error in the height of the electrodes etc. The wet-etched LTCC wafer was anodically bonded with an SOI wafer with diaphragms and Au electrodes under a standard condition. 100 % yield of both hermetic sealing and electrical connection was confirmed. A thermal shock test was performed, and no significant change of sealing pressure and the resistance of electrical connections was observed at least up to 3000 cycles.

本文言語English
ホスト出版物のタイトル2012 IEEE 25th International Conference on Micro Electro Mechanical Systems, MEMS 2012
ページ369-372
ページ数4
DOI
出版ステータスPublished - 2012 5月 7
イベント2012 IEEE 25th International Conference on Micro Electro Mechanical Systems, MEMS 2012 - Paris, France
継続期間: 2012 1月 292012 2月 2

出版物シリーズ

名前Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
ISSN(印刷版)1084-6999

Other

Other2012 IEEE 25th International Conference on Micro Electro Mechanical Systems, MEMS 2012
国/地域France
CityParis
Period12/1/2912/2/2

ASJC Scopus subject areas

  • 電子材料、光学材料、および磁性材料
  • 凝縮系物理学
  • 機械工学
  • 電子工学および電気工学

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