Verification of prediction method for electromigration failure using angled polycrystalline line

Electromigration is one of the main damage mechanisms of interconnecting metal lines. Recently, a governing parameter for electromigration damage in passivated polycrystalline lines, AFD*_gen, was formulated, and a prediction method for electromigration failure in passivated polycrystalline line was developed using AFD*_gen. This method requires only the film characteristics of the metal line and the application is not limited by a line shape and operating condition. The usefulness of the method has been shown using the straight-shaped lines. Using the symmetrically and asymmetrically angled lines experiments are performed, and the line-shape dependency of the lifetime obtained by the prediction method is verified comparing with the results obtained from the experiment.