抄録
Electromigration is one of the main damage mechanisms of interconnecting metal lines. Recently, a governing parameter for electromigration damage in passivated polycrystalline lines, AFD*gen, was formulated, and a prediction method for electromigration failure in passivated polycrystalline line was developed using AFD*gen. This method requires only the film characteristics of the metal line and the application is not limited by a line shape and operating condition. The usefulness of the method has been shown using the straight-shaped lines. Using the symmetrically and asymmetrically angled lines experiments are performed, and the line-shape dependency of the lifetime obtained by the prediction method is verified comparing with the results obtained from the experiment.
本文言語 | English |
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ページ(範囲) | 263-268 |
ページ数 | 6 |
ジャーナル | Key Engineering Materials |
巻 | 297-300 I |
DOI | |
出版ステータス | Published - 2005 1月 1 |
ASJC Scopus subject areas
- 材料科学(全般)
- 材料力学
- 機械工学