Verification of prediction method for electromigration failure using angled polycrystalline line

S. Uno, M. Hasegawa, K. Sasagawa, M. Saka

研究成果: Article査読

抄録

Electromigration is one of the main damage mechanisms of interconnecting metal lines. Recently, a governing parameter for electromigration damage in passivated polycrystalline lines, AFD*gen, was formulated, and a prediction method for electromigration failure in passivated polycrystalline line was developed using AFD*gen. This method requires only the film characteristics of the metal line and the application is not limited by a line shape and operating condition. The usefulness of the method has been shown using the straight-shaped lines. Using the symmetrically and asymmetrically angled lines experiments are performed, and the line-shape dependency of the lifetime obtained by the prediction method is verified comparing with the results obtained from the experiment.

本文言語English
ページ(範囲)263-268
ページ数6
ジャーナルKey Engineering Materials
297-300 I
DOI
出版ステータスPublished - 2005 1 1

ASJC Scopus subject areas

  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering

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