Varifocal mirror integrated with scanner using wafer bonding technology

Kenta Nakazawa, Takashi Sasaki, Hiromasa Furuta, Jiro Kamiya, Hideki Sasaki, Toshikazu Kamiya, Kazuhiro Hane

研究成果: Conference contribution

抄録

The integration of a varifocal mirror with a scanner using wafer bonding technology is presented. The wafer bonding technology enables us to enlarge the design possibility. A 2 mm diameter varifocal mirror is bonded on the scanner. The optical scanning angle is 7° at 3.59 kHz. The focal length changes from infinity to 139 mm.

本文言語English
ホスト出版物のタイトル2016 International Conference on Optical MEMS and Nanophotonics, OMN 2016 - Proceedings
出版社IEEE Computer Society
ISBN(電子版)9781509010356
DOI
出版ステータスPublished - 2016 9 13
イベント21st International Conference on Optical MEMS and Nanophotonics, OMN 2016 - Singapore, Singapore
継続期間: 2016 7 312016 8 4

出版物シリーズ

名前International Conference on Optical MEMS and Nanophotonics
2016-September
ISSN(印刷版)2160-5033
ISSN(電子版)2160-5041

Other

Other21st International Conference on Optical MEMS and Nanophotonics, OMN 2016
CountrySingapore
CitySingapore
Period16/7/3116/8/4

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

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