Variation of the Lifetime of Interconnections Due to the Crystallinity of Grain Boundaries in Thin-Film Interconnections

Ryota Mizuno, Yutaro Nakoshi, Ken Suzuki, Hideo Miura

研究成果: Conference contribution

抄録

The crystallinity of the fine interconnections was evaluated quantitatively by using electron back-scatter diffraction (EBSD) analysis The image quality (IQ) value, the average sharpness of Kikuchi pattern obtained from the analysis was applied to the quantitative evaluation of the quality of grains and grain boundaries in polycrystalline metalic thin-film interconnections. It was found that the main degradation path under high current density was along porous grain bundaries in the polycrystalline materials, and therefore, the effective lifetime due to electromigration varied drastivally depending on the volume ratio of the grain boundaries with low crystallinity in the interconnections. The crystallinity of fine interconnections varied depending on their fabrication process and their thermal hystory after the fabrication. In the case of electroplating, it was found to be important to control the lattice mismatch between the electroplated thin film and the substrate material used for the electroplating. The effective lifetime of copper interconnection varied about 100 times as a strong function of the crystallinity.

本文言語English
ホスト出版物のタイトルEMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging
出版社Institute of Electrical and Electronics Engineers Inc.
ISBN(電子版)9781538656426
DOI
出版ステータスPublished - 2019 3 5
イベント20th International Conference on Electronic Materials and Packaging, EMAP 2018 - Clear Water Bay, Hong Kong
継続期間: 2018 12 172018 12 20

出版物シリーズ

名前EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging

Conference

Conference20th International Conference on Electronic Materials and Packaging, EMAP 2018
国/地域Hong Kong
CityClear Water Bay
Period18/12/1718/12/20

ASJC Scopus subject areas

  • 電子材料、光学材料、および磁性材料

フィンガープリント

「Variation of the Lifetime of Interconnections Due to the Crystallinity of Grain Boundaries in Thin-Film Interconnections」の研究トピックを掘り下げます。これらがまとまってユニークなフィンガープリントを構成します。

引用スタイル