Vacuum-sealed silicon micromachined pressure sensors

Masayoshi Esashi, Susumu Sugiyama, Kyoichi Ikeda, Yuelin Wang, Haruzo Miyashita

研究成果: Article査読

91 被引用数 (Scopus)

抄録

Considerable progress in silicon pressure sensors has been made in recent years. This paper discusses three types of vacuumsealed silicon inicromachined pressure sensors that represent the present state of the art in this important area. The devices are a capacitive vacuum sensor, a surface-micromachined microdiaphragm pressure sensor, and a resonant pressure sensor. Vacuum sealing for these devices is accomplished using anodic bonding, films deposited using low-pressure chemical vapor deposition, and thermal otit-diffusion of hydrogen, respectively. These sensors emphasize high sensitivity, small size, and excellent stability, respectively. The silicon-diaphragm vacuum sensor uses electrostatic force balancing to achieve a wide pressure measurement range.

本文言語English
ページ(範囲)1627-1638
ページ数12
ジャーナルProceedings of the IEEE
86
8
DOI
出版ステータスPublished - 1998

ASJC Scopus subject areas

  • 電子工学および電気工学

フィンガープリント

「Vacuum-sealed silicon micromachined pressure sensors」の研究トピックを掘り下げます。これらがまとまってユニークなフィンガープリントを構成します。

引用スタイル