Transmission electron microscopy observations on Cu-Mg alloy systems

Ken Ichi Nishikawa, Satoshi Semboshi, Toyohiko J. Konno

研究成果: Conference contribution

抄録

Environmentally friendly Cu-based alloys with high strength and low electrical resistivity have been much sought in order to replace deleterious Cu-Be alloys for electrical applications. As one of the candidate systems, we have examined age-hardening behaviors of Cu-Mg alloys by using transmission electron microscopy (TEM). Cu-2.26wt.%Mg alloys were solution-treated and annealed at 723K, and their structural changes have been investigated. The Vickers hardness measurements showed that they aged-harden gradually. Our TEM observations showed that annealing for 6h brings about precipitation of numerous needle-like particles of 10 nm in length. The diffraction studies indicated these precipitates consist of the Cu2Mg phase with {111}Cu habit planes. When annealed for 96h, these precipitates become semi-coherent, which was manifested by moiré fringes; while maintaining the orientation relationship of (111)Cu//(111)Cu2Mg, [110]Cu//[110]Cu2Mg.

本文言語English
ホスト出版物のタイトルDesigning of Interfacial Structures in Advanced Materials and their Joints
編集者Masaaki Naka
出版社Trans Tech Publications Ltd
ページ103-108
ページ数6
ISBN(印刷版)9783908451334
DOI
出版ステータスPublished - 2007
外部発表はい
イベントInternational Workshop on Designing of Interfacial Structures in Advanced Materials and their Joints, DIS 2006 - Osaka, Japan
継続期間: 2006 5月 182006 5月 20

出版物シリーズ

名前Solid State Phenomena
127
ISSN(印刷版)1012-0394
ISSN(電子版)1662-9779

Other

OtherInternational Workshop on Designing of Interfacial Structures in Advanced Materials and their Joints, DIS 2006
国/地域Japan
CityOsaka
Period06/5/1806/5/20

ASJC Scopus subject areas

  • 原子分子物理学および光学
  • 材料科学(全般)
  • 凝縮系物理学

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