Transfer technology for fabrication of flexible OTFT backplane

Toshihiro Yamamoto, Yoshihide Fujisaki, Akihiro Kinoshita, Tatsuya Takei, Tadahiro Furukawa, Hideo Fujikake, Yoshiki Nakajima, Masayuki Hosoi

研究成果: Conference contribution

抄録

A new transfer technology to realize flexible organic thin film transistors (OTFTs) on a plastic substrate has been developed. The basic principle of the proposed method is that all the fabrication processes for the OTFT array on glass substrate have been completed, and the OTFT is then transferred onto the plastic film. A 5.8-inch diagonal wide-QQVGA OTFT array was fabricated using this technology. We confirmed that degree of substrate deformation with the proposed technology could be suppressed in comparison with that with conventional direct formation method, and also that no significant degradation in the electrical characteristics of the OTFT was observed as a result of the transfer process. It is thought that this will be a key technology for the fabrication of large flexible displays with TFT backplanes.

本文言語English
ホスト出版物のタイトル2011 IEEE Industry Applications Society Annual Meeting, IAS 2011
DOI
出版ステータスPublished - 2011
外部発表はい
イベント2011 46th IEEE Industry Applications Society Annual Meeting, IAS 2011 - Orlando, FL, United States
継続期間: 2011 10 92011 10 13

出版物シリーズ

名前Conference Record - IAS Annual Meeting (IEEE Industry Applications Society)
ISSN(印刷版)0197-2618

Other

Other2011 46th IEEE Industry Applications Society Annual Meeting, IAS 2011
CountryUnited States
CityOrlando, FL
Period11/10/911/10/13

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Industrial and Manufacturing Engineering
  • Electrical and Electronic Engineering

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