Tiny VCSEL chip self-assembly for advanced chip-to-wafer 3D and hetero integration

Takafumi Fukushima, Yuka Ito, Mariappan Murugesan, Jichoru Be, Kanuku Ri, Koji Choki, Tetsu Tanaka, Mitsumasa Koyanagi

研究成果: Conference contribution

1 被引用数 (Scopus)

抄録

A 12-channel vertical cavity surface emitting laser (VCSEL) chip was heterogeneously self-assembled to a glass interposer wafer by liquid surface tension as a driving force. The size of the VCSEL chip was 0.35 mm wide and 3 mm long. From the square dummy chips having structurally similar periphery to the VCSEL, the step structure at the chip edge was found to be significantly dependent on the alignment accuracies. From the rectangular dummy chips having the same sizes to the long VCSEL, the tiny chips were precisely self-assembled with alignment accuracies within 2 μm even when they were manually placed on water droplets provided on host Si wafers. After selfassembly of the VCSEL chip and the subsequent thermal compression, the VCSEL was accurately positioned, successfully emitted 850-nm light, and exhibited no degradation of the I-V characteristics. This paper also presents our recent progress on the hybrid integration of chip-scale photonic devices with 3D/TSV technologies for optical interconnections.

本文言語English
ホスト出版物のタイトル2014 International 3D Systems Integration Conference, 3DIC 2014 - Proceedings
出版社Institute of Electrical and Electronics Engineers Inc.
ISBN(電子版)9781479984725
DOI
出版ステータスPublished - 2014 1 1
イベントInternational 3D Systems Integration Conference, 3DIC 2014 - Kinsdale, Ireland
継続期間: 2014 12 12014 12 3

出版物シリーズ

名前2014 International 3D Systems Integration Conference, 3DIC 2014 - Proceedings

Other

OtherInternational 3D Systems Integration Conference, 3DIC 2014
国/地域Ireland
CityKinsdale
Period14/12/114/12/3

ASJC Scopus subject areas

  • 電子工学および電気工学
  • 電子材料、光学材料、および磁性材料
  • ハードウェアとアーキテクチャ

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