抄録
The high-speed data services, up to about 14.4Mbps, for the 3G networks will be supported by the high-speed downlink packet access (HSDPA) concept. Adaptive modulation and coding (AMC), multicode operation and hybrid automatic repeat request (HARQ) are the enabling technologies used for HSDPA. The next generation mobile communications systems is anticipated to support even higher data rates up to and exceeding 100Mbps. MC-CDMA and DS-CDMA, both using frequency-domain equalization, are considered the most promising wireless access schemes. In this paper, we compare the throughput performance of MC- and DS-CDMA when packet data are transmitted as in HSDPA with AMC and HARQ using multiple codes.
| 本文言語 | English |
|---|---|
| ページ（範囲） | 1575-1579 |
| ページ数 | 5 |
| ジャーナル | IEEE Vehicular Technology Conference |
| 巻 | 61 |
| 号 | 3 |
| 出版ステータス | Published - 2005 10月 17 |
| イベント | 2005 IEEE 61st Vehicular Technology Conference -VTC 2005 - Spring Stockholm: Paving the Path for a Wireless Future - Stockholm, Sweden 継続期間: 2005 5月 30 → 2005 6月 1 |
ASJC Scopus subject areas
- コンピュータ サイエンスの応用
- 電子工学および電気工学
- 応用数学