Through Silicon photonic via (TSPV) with Si core for low loss and high-speed data transmission in opto-electronic 3-D LSI

Akihiro Noriki, Kang Wook Lee, Jichoel Bea, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

研究成果: Conference contribution

11 被引用数 (Scopus)

抄録

To realize very high performance computing system, we have proposed a novel opto-electronic 3-D LSI in which both electrical and optical devices are integrated. For realizing such opto-electronic 3-D LSI, through Si photonic via (TSPV) is indispensable for vertical light transmission. In this work, we fabricated the TSPV comprising Si core and epoxy cladding. We measured near field patterns (NFP) of laser light passed through the TSPV to evaluate its light confinement effect. From the results of NFP measurement, we confirmed that the laser light was successfully confined and propagated in the Si core region of the TSPV. We successfully developed a fabrication process to form both the TSPV and TSV simultaneously. The size of the fabricated TSPV and TSV was 20μmx20μm and 16μmx16μm, respectively.

本文言語English
ホスト出版物のタイトルIEEE 3D System Integration Conference 2010, 3DIC 2010
DOI
出版ステータスPublished - 2010 12 1
イベント2nd IEEE International 3D System Integration Conference, 3DIC 2010 - Munich, Germany
継続期間: 2010 11 162010 11 18

出版物シリーズ

名前IEEE 3D System Integration Conference 2010, 3DIC 2010

Other

Other2nd IEEE International 3D System Integration Conference, 3DIC 2010
国/地域Germany
CityMunich
Period10/11/1610/11/18

ASJC Scopus subject areas

  • 制御およびシステム工学

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