Thin-film formation on a rotating disk during the spin-coating process is analyzed. In the experiments for a solution of PMMA (polymethyl methacrylate) solute and chlorobenzene solvent, the final film thickness of dry film formed on silicon wafers for integrated circuits is measured with an ellipse thickness meter. Also, the transient film thickness during the entire film formation process on a rotating optical glass is measured using a laser displacement meter. A numerical calculation considering heat and mass transfer such as solvent evaporation is performed using a one-dimensional complete model proposed by the authors for each phase of liquid film and adjacent gas phase. Satisfactory agreement is obtained between these numerical and experimental results and the effect of various process parameters, e.g., spinning speed and initial film thickness, is clarified by this study.
|ジャーナル||Transactions of the Japan Society of Mechanical Engineers Series B|
|出版ステータス||Published - 1991|
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