Thermal transients during processing of materials by very high power ultrasonic additive manufacturing

M. R. Sriraman, Matt Gonser, Hiromichi T. Fujii, S. S. Babu, Matt Bloss

研究成果: Article査読

64 被引用数 (Scopus)

抄録

Dynamic recrystallisation at interfaces has been suggested as the bonding mechanism in the joining of metallic tapes, during very high power ultrasonic additive manufacturing. To understand the reasons for such occurrence of dynamic recrystallization, thermal transients from the interface regions were recorded during processing of aluminum alloy (3003 and 6061 series) and 11 000 copper tapes under similar conditions. Measurements in 3003 Al were also carried out for different processing parameters. Measured peak temperatures were seen to increase with increase in shear strength of the material and ultrasonic vibration amplitude. The observations have been rationalized based on interfacial heating at asperities due to adiabatic plastic deformation.

本文言語English
ページ(範囲)1650-1657
ページ数8
ジャーナルJournal of Materials Processing Technology
211
10
DOI
出版ステータスPublished - 2011 10

ASJC Scopus subject areas

  • セラミックおよび複合材料
  • コンピュータ サイエンスの応用
  • 金属および合金
  • 産業および生産工学

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