Thermal transients during processing of 3003 Al-H18 multilayer build by very high-power ultrasonic additive manufacturing

M. R. Sriraman, Matt Gonser, Daniel Foster, Hiromichi T. Fujii, S. S. Babu, Matt Bloss

研究成果: Article査読

22 被引用数 (Scopus)

抄録

Previous investigations suggested a gradient in bond microstructure along the height of a "build" made by very high power ultrasonic additive manufacturing - a rapid prototyping process that is based on ultrasonic seam welding. The bonding of foils is associated with the occurrence of dynamic recrystallization at the interfaces between them. To understand heating patterns across the build that may be responsible for such microstructure evolution, temperatures from different interface regions were recorded simultaneously during the fabrication of a 3003 Al-H18 multilayer build under a given processing condition. Thermal transients were observed over multiple interfaces of the build during welding of each layer. The temperatures were the highest for the layer processed and were found to diminish beneath with each subsequent layer. Such maximum temperatures also depended on the height at which the new layer was bonded. The occurrence of transients across the build is rationalized based on heat being conducted away from the processed layer.

本文言語English
ページ(範囲)133-144
ページ数12
ジャーナルMetallurgical and Materials Transactions B: Process Metallurgy and Materials Processing Science
43
1
DOI
出版ステータスPublished - 2012 2

ASJC Scopus subject areas

  • 凝縮系物理学
  • 材料力学
  • 金属および合金
  • 材料化学

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