Thermal conductivity of Ni3(Si,Ti) single-phase alloys

Satoshi Semboshi, Tatsuro Takeuchi, Yasuyuki Kaneno, Akihiro Iwase, Takayuki Takasugi

研究成果: Article査読

3 被引用数 (Scopus)

抄録

Thermal conductivities of Ni3(Si,Ti) single-phase alloys with an L12 structure as functions of composition and temperature were measured to provide information for high-temperature structural applications. It was confirmed that the Ni3(Si,Ti) alloy has an extremely large single-phase region for the compositions Ni78(Si22-x,Tix) (x = 0–12 at.%), Ni89−y(Si11,Tiy) (y = 9.5–12 at.%), and Ni89−z(Siz,Ti11) (z = 9.5–12 at.%). The thermal conductivities at 293 K of all the Ni3(Si,Ti) single-phase alloys were estimated to be between 8 W/mK and 12 W/mK, which are lower than those of almost all other stoichiometric compounds. In the Ni3(Si,Ti) single-phase region, the thermal conductivity increased more significantly by increasing the Ni content than by varying the Si and Ti contents. The thermal conductivity of all the Ni3(Si,Ti) single-phase alloys increased monotonically with an increase in temperature. The temperature coefficient of thermal conductivity increased as the value of the thermal conductivity at 293 K was low, according to Mooij's relationship. Consequently, the thermal conductivity in the Ni3(Si,Ti) single-phase region became larger and less sensitive to the composition at higher temperatures above 1073 K, ranging between 22 W/mK and 24 W/mK.

本文言語English
ページ(範囲)119-125
ページ数7
ジャーナルIntermetallics
92
DOI
出版ステータスPublished - 2018 1

ASJC Scopus subject areas

  • 化学 (全般)
  • 材料力学
  • 機械工学
  • 金属および合金
  • 材料化学

フィンガープリント

「Thermal conductivity of Ni<sub>3</sub>(Si,Ti) single-phase alloys」の研究トピックを掘り下げます。これらがまとまってユニークなフィンガープリントを構成します。

引用スタイル