Thermal analysis of multi-pass laser irradiation on fused silica

Peng Yao, Chuanzhen Huang, Jun Wang, Tsunemoto Kuriyagawa

研究成果: Conference contribution

抜粋

A rough ground fused silica surface can be ground in a ductile mode by ultra-precision grinding after repairing the surface and subsurface micro cracks (SSMC) by Co2 laser irradiation. In this paper, 2D finite element thermal analysis of unidirectional multi-pass laser irradiation on fused silica was conducted, and the simulation results were compared with the thermal analysis and experiments results of single pass laser irradiation. Thermal analysis results show that the SSMC on the ground fused silica can be repaired and surface roughness can be decreased simultaneously by unidirectinal laser raster scan with a power of 10.5 W, a scan velocity of 0.2 m/s and a scan spacing of 40 μm.

元の言語English
ホスト出版物のタイトルAdvances in Abrasive Technology XV
ページ621-626
ページ数6
DOI
出版物ステータスPublished - 2012
イベント15th International Symposium on Advances in Abrasive Technology, ISAAT 2012 - , Singapore
継続期間: 2012 9 252012 9 28

出版物シリーズ

名前Advanced Materials Research
565
ISSN(印刷物)1022-6680

Other

Other15th International Symposium on Advances in Abrasive Technology, ISAAT 2012
Singapore
期間12/9/2512/9/28

ASJC Scopus subject areas

  • Engineering(all)

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  • これを引用

    Yao, P., Huang, C., Wang, J., & Kuriyagawa, T. (2012). Thermal analysis of multi-pass laser irradiation on fused silica. : Advances in Abrasive Technology XV (pp. 621-626). (Advanced Materials Research; 巻数 565). https://doi.org/10.4028/www.scientific.net/AMR.565.621