Thermal analysis of multi-pass laser irradiation on fused silica

Peng Yao, Chuanzhen Huang, Jun Wang, Tsunemoto Kuriyagawa

研究成果: Conference contribution

抄録

A rough ground fused silica surface can be ground in a ductile mode by ultra-precision grinding after repairing the surface and subsurface micro cracks (SSMC) by Co2 laser irradiation. In this paper, 2D finite element thermal analysis of unidirectional multi-pass laser irradiation on fused silica was conducted, and the simulation results were compared with the thermal analysis and experiments results of single pass laser irradiation. Thermal analysis results show that the SSMC on the ground fused silica can be repaired and surface roughness can be decreased simultaneously by unidirectinal laser raster scan with a power of 10.5 W, a scan velocity of 0.2 m/s and a scan spacing of 40 μm.

本文言語English
ホスト出版物のタイトルAdvances in Abrasive Technology XV
ページ621-626
ページ数6
DOI
出版ステータスPublished - 2012
イベント15th International Symposium on Advances in Abrasive Technology, ISAAT 2012 - , Singapore
継続期間: 2012 9月 252012 9月 28

出版物シリーズ

名前Advanced Materials Research
565
ISSN(印刷版)1022-6680

Other

Other15th International Symposium on Advances in Abrasive Technology, ISAAT 2012
国/地域Singapore
Period12/9/2512/9/28

ASJC Scopus subject areas

  • 工学(全般)

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