抜粋
A rough ground fused silica surface can be ground in a ductile mode by ultra-precision grinding after repairing the surface and subsurface micro cracks (SSMC) by Co2 laser irradiation. In this paper, 2D finite element thermal analysis of unidirectional multi-pass laser irradiation on fused silica was conducted, and the simulation results were compared with the thermal analysis and experiments results of single pass laser irradiation. Thermal analysis results show that the SSMC on the ground fused silica can be repaired and surface roughness can be decreased simultaneously by unidirectinal laser raster scan with a power of 10.5 W, a scan velocity of 0.2 m/s and a scan spacing of 40 μm.
| 元の言語 | English |
|---|---|
| ホスト出版物のタイトル | Advances in Abrasive Technology XV |
| ページ | 621-626 |
| ページ数 | 6 |
| DOI | |
| 出版物ステータス | Published - 2012 |
| イベント | 15th International Symposium on Advances in Abrasive Technology, ISAAT 2012 - , Singapore 継続期間: 2012 9 25 → 2012 9 28 |
出版物シリーズ
| 名前 | Advanced Materials Research |
|---|---|
| 巻 | 565 |
| ISSN（印刷物） | 1022-6680 |
Other
| Other | 15th International Symposium on Advances in Abrasive Technology, ISAAT 2012 |
|---|---|
| 国 | Singapore |
| 期間 | 12/9/25 → 12/9/28 |
ASJC Scopus subject areas
- Engineering(all)
フィンガープリント Thermal analysis of multi-pass laser irradiation on fused silica' の研究トピックを掘り下げます。これらはともに一意のフィンガープリントを構成します。
これを引用
Yao, P., Huang, C., Wang, J., & Kuriyagawa, T. (2012). Thermal analysis of multi-pass laser irradiation on fused silica. ： Advances in Abrasive Technology XV (pp. 621-626). (Advanced Materials Research; 巻数 565). https://doi.org/10.4028/www.scientific.net/AMR.565.621