## 抄録

Main reasons of metal line failure m electronic packaging are electromigration and thermal stress. It, therefore, is essential for the study of the metal line reliability to analyze the distributions of current density and temperature which affect electromigration and thermal stress. In electrothermal problem, though the several studies treating a crack have been performed, the study treating a corner with any angle, which exists frequently in the metal line pattern, has not yet been done. Saka et al. (1994) have treated the electrothermal crack problem considering the Joule heating and the Thomson effect and shown that the Thomson effect is not negligible on the heat flux singularity at the crack tip when the material is subjected to a current flow the density of which is high. In order to analyze a crack problem in electrothermal field, at first, the two-dimensional electrothermal problem which is concerned with steady current flow near a corner in an angled metal line with finite width was treated in this study. The asymptotic solutions of the current density distribution and the temperature distribution considering not only the Joule heating but also the Thomson effect were theoretically derived near the corner, and the intensities of the singular current density field and of the singular heat flux field were discussed. Furthermore the asymptotic solutions of the distributions of current density and temperature for a crack problem were given as the special case of the corner analysis.

本文言語 | English |
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ページ | 1-6 |

ページ数 | 6 |

出版ステータス | Published - 1995 12 1 |

イベント | Proceedings of the 1995 ASME International Mechanical Engineering Congress and Exposition - San Francisco, CA, USA 継続期間: 1995 11 12 → 1995 11 17 |

### Other

Other | Proceedings of the 1995 ASME International Mechanical Engineering Congress and Exposition |
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City | San Francisco, CA, USA |

Period | 95/11/12 → 95/11/17 |

## ASJC Scopus subject areas

- Electrical and Electronic Engineering
- Mechanical Engineering