The thickness-ratio effects of Ni/Nb electrode on wire bonding strength with n-type 4H-SiC

Kunhwa Jung, Daisuke Ando, Yuji Sutou, Tetsuya Oyamada, Masamoto Tanaka, Junichi Koike

研究成果: Conference contribution

抄録

The thickness-ratio effects of Ni/Nb bi-layer electrodes were studied for power device applications. The reaction microstructure and electrical contact property were investigated after annealing at 1000 °C and compared with the results of an Ni electrode. Microstructure-related problems of the Ni electrode could be successfully resolved without sacrificing ohmic contact behavior by the addition of Nb to a Ni based electrode. Carbon precipitation on the electrode surface was reduced with increasing Nb thickness by the formation of carbides, which led to good adhesion between the electrode and a wiring pad. High shear strength of the bonded wire was also obtained by the elimination of the carbon precipitates on the electrode surface.

本文言語English
ホスト出版物のタイトルSilicon Carbide and Related Materials 2011, ICSCRM 2011
編集者Robert P. Devaty, Michael Dudley, T. Paul Chow, Philip G. Neudeck
出版社Trans Tech Publications Ltd
ページ829-832
ページ数4
ISBN(印刷版)9783037854198
DOI
出版ステータスPublished - 2012
イベント14th International Conference on Silicon Carbide and Related Materials 2011, ICSCRM 2011 - Cleveland, OH, United States
継続期間: 2011 9月 112011 9月 16

出版物シリーズ

名前Materials Science Forum
717-720
ISSN(印刷版)0255-5476
ISSN(電子版)1662-9752

Other

Other14th International Conference on Silicon Carbide and Related Materials 2011, ICSCRM 2011
国/地域United States
CityCleveland, OH
Period11/9/1111/9/16

ASJC Scopus subject areas

  • 材料科学(全般)
  • 凝縮系物理学
  • 材料力学
  • 機械工学

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