Temporary bonding strength control for self-assembly-based 3D integration

Takafumi Fukushima, Yuki Ohara, Jichoru Be, Mariappan Murugesan, Kanuku Ri, Tetsu Tanaka, Mitsumasa Koyanagi

研究成果: Conference contribution

1 被引用数 (Scopus)

抄録

We have demonstrated bonding strength control for self-assembly-based 3D integration in which many chips are instantly assembled on a wafer all at once by using liquid droplets, and then, temporarily bonded to the wafer. The wafer is named Reconfigured Wafer. The self-assembly-based multichip-to-wafer 3D stacking is called reconfigured-wafer-to-wafer 3D integration. The alignment accuracy is found to be within 1 μm and the temporal bonding strength is well controlled by the quality of oxides as a bonding interface material, liquid types (concentration of additives), total bonding area, and surface roughness of the oxides. The self-assembled and temporarily bonded chips are successfully transferred to another wafer in a face-to-face bonding manner in batch processing.

本文言語English
ホスト出版物のタイトル2011 IEEE International 3D Systems Integration Conference, 3DIC 2011
DOI
出版ステータスPublished - 2011 12 1
イベント2011 IEEE International 3D Systems Integration Conference, 3DIC 2011 - Osaka, Japan
継続期間: 2012 1 312012 2 2

出版物シリーズ

名前2011 IEEE International 3D Systems Integration Conference, 3DIC 2011

Other

Other2011 IEEE International 3D Systems Integration Conference, 3DIC 2011
CountryJapan
CityOsaka
Period12/1/3112/2/2

ASJC Scopus subject areas

  • Control and Systems Engineering

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