Surface-tension driven self-assembly for VCSEL chip bonding to achieve 3D and hetero integration

Y. Ito, Takafumi Fukushima, Kanuku Ri, K. Choki, Tetsu Tanaka, Mitsumasa Koyanagi

研究成果: Conference contribution

抜粋

Self-assembly with liquid surface tension was applied to tiny chips that were difficult to manipulate. Dummy chips that mimics VCSEL were aligned toward hydrophilic sites surrounding a hydrophobic area on an Si interposer. The alignment accuracies were 0 and-2.0 μm in X and Y directions.

元の言語English
ホスト出版物のタイトルProceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014
出版者IEEE Computer Society
ページ数1
ISBN(印刷物)9781479952618
DOI
出版物ステータスPublished - 2014 1 1
イベント2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014 - Tokyo, Japan
継続期間: 2014 7 152014 7 16

出版物シリーズ

名前Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014

Other

Other2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014
Japan
Tokyo
期間14/7/1514/7/16

ASJC Scopus subject areas

  • Filtration and Separation

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  • これを引用

    Ito, Y., Fukushima, T., Ri, K., Choki, K., Tanaka, T., & Koyanagi, M. (2014). Surface-tension driven self-assembly for VCSEL chip bonding to achieve 3D and hetero integration. : Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014 [6886154] (Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014). IEEE Computer Society. https://doi.org/10.1109/LTB-3D.2014.6886154