TY - GEN
T1 - Surface Covering Structure and Active Sensing with MEMS-CMOS Integrated 3-Axis Tactile Sensors for Object Slip Detection and Texture Recognition
AU - Javaid, Sumeyya
AU - Hirano, Hideki
AU - Tanaka, Shuji
AU - Muroyama, Masanori
N1 - Publisher Copyright:
© 2021 IEEE.
PY - 2021/6/20
Y1 - 2021/6/20
N2 - For realizing practical robot applications, in this paper surface covering and active sensing with 2.73 × 2.73mm2 size MEMS-CMOS integrated 3-axis tactile sensor devices are proposed. For detecting slippage of objects, we developed surface covering structure considering force concentration to the sensor diaphragm and the diaphragm protection from overload. The fabricated sensor device successfully showed the slippage prediction, slipping, sliding and falling of the various type's objects. Next, for recognizing the object ures, the sensing surface of the fabricated tactile sensor device moved along object surfaces. With applying force, initially 6N, depending on the object ures unique time series sensing data appeared and can be used for recognition.
AB - For realizing practical robot applications, in this paper surface covering and active sensing with 2.73 × 2.73mm2 size MEMS-CMOS integrated 3-axis tactile sensor devices are proposed. For detecting slippage of objects, we developed surface covering structure considering force concentration to the sensor diaphragm and the diaphragm protection from overload. The fabricated sensor device successfully showed the slippage prediction, slipping, sliding and falling of the various type's objects. Next, for recognizing the object ures, the sensing surface of the fabricated tactile sensor device moved along object surfaces. With applying force, initially 6N, depending on the object ures unique time series sensing data appeared and can be used for recognition.
KW - Active Sensing
KW - MEMS-CMOS Integrated Tactile Sensor
KW - Slip Detection
KW - Surface Covering Structure
KW - Texture Recognition
UR - http://www.scopus.com/inward/record.url?scp=85114961055&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85114961055&partnerID=8YFLogxK
U2 - 10.1109/Transducers50396.2021.9495637
DO - 10.1109/Transducers50396.2021.9495637
M3 - Conference contribution
AN - SCOPUS:85114961055
T3 - 21st International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2021
SP - 222
EP - 225
BT - 21st International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2021
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 21st International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2021
Y2 - 20 June 2021 through 25 June 2021
ER -