Suppression of surface micro-roughness of silicon wafer by addition of alcohol into ultra pure water for rinsing peocess

M. Yamamoto, K. Nii, H. Morinaga, A. Teramoto, T. Ohmi

研究成果: Conference contribution

2 被引用数 (Scopus)

抄録

The suppression of surface micro-roughness by improved rinsing process was studied. The progress for cleaning method to prepare the flat silicon wafer surface on atomic order is intensely needed for higher carrier mobility. Silicon surface is exposed to several chemical substances through cleaning processes. Ultrapure water also dissolves silicon atoms and roughens the silicon surface. Several kinds of alcohols and ketone, especially isopropyl alcohol (IPA), were used as additives for ultrapure water to investigate the effect on suppression of surface roughening by water. The additives suppress roughening of the silicon surface by preventing silicon dissolving into the solution. The structure and concentration of additive and the mechanism of the suppression of surface micro-roughness was investigated.

本文言語English
ホスト出版物のタイトルCleaning Technology in Semiconductor Device Manufacturing IX
出版社Electrochemical Society Inc.
ページ51-58
ページ数8
3
ISBN(電子版)9781607685395
出版ステータスPublished - 2006
外部発表はい
イベント9th International Symposium on Cleaning Technology in Semiconductor Device Manufacturing - 2005 Fall Meeting of the Electrochemical Society - Los Angeles, CA, United States
継続期間: 2005 10月 162005 10月 21

出版物シリーズ

名前ECS Transactions
番号3
1
ISSN(印刷版)1938-5862
ISSN(電子版)1938-6737

Other

Other9th International Symposium on Cleaning Technology in Semiconductor Device Manufacturing - 2005 Fall Meeting of the Electrochemical Society
国/地域United States
CityLos Angeles, CA
Period05/10/1605/10/21

ASJC Scopus subject areas

  • 工学(全般)

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