Suppression of multi-path couplings in MCM with a flip-chipped SiGe-MMIC

Tamotsu Nishino, Kenichi Maeda, Mitsuhiro Shimozawa, Takayuki Ikushima, Keiichi Sadahiro, Takatoshi Katsura, Noriharu Suematsu, Kenji Itoh, Hideyuki Oohashi, Tadashi Takagi, Osami Ishida

研究成果: Conference article査読

3 被引用数 (Scopus)

抄録

Techniques to obtain high isolation property in a multi-chip module (MCM) between pads of a SiGe-MMIC flip-chipped on a low temperature co-fired ceramic (LTCC) are discussed. In such a MCM, there are two coupling paths. One is a path through the LTCC and the other is a path through the MMIC. To improve the total isolation property, structures to reduce the two coupling paths are required because the paths of such leaks are not in series but in parallel. We examined disposition of several kinds of ground patterns on the LTCC. Also, we devised a metal plate on a bias circuit as a shielding structure on the SiGe-MMIC. The effectiveness of the isolating structures was verified by measuring IIP2 in a receiver MCM with a direct conversion SiGe-MMIC. The IIP2 property has been improved successfully as well as the isolation property.

本文言語English
ページ(範囲)1385-1388
ページ数4
ジャーナルIEEE MTT-S International Microwave Symposium Digest
3
出版ステータスPublished - 2002 1 1
外部発表はい
イベントIEEE MTT-S International Microwave Symposium Digest - Seattle, WA, United States
継続期間: 2002 6 22002 6 7

ASJC Scopus subject areas

  • Radiation
  • Condensed Matter Physics
  • Electrical and Electronic Engineering

フィンガープリント 「Suppression of multi-path couplings in MCM with a flip-chipped SiGe-MMIC」の研究トピックを掘り下げます。これらがまとまってユニークなフィンガープリントを構成します。

引用スタイル