Stable growth and kinetic roughening in electrochemical deposition

Atsushi Iwamoto, Tatsuo Yoshinobu, Hiroshi Iwasaki

研究成果: Article査読

85 被引用数 (Scopus)

抄録

We studied kinetic roughening of copper which was electrodeposited at slow rates. The surfaces showed a unique scaling. In the shorter length regime, the interface width scaled with the length scale L as L (=0.870.05). In the longer length regime, the width scaled with the deposition time t as t(=0.450.05). The value of +, 2.8, is much larger than 2 predicted for the case where the growing direction is normal to the surface everywhere. The scaling behavior is interpreted as the result of enhanced growth of the protrusions owing to nonlocal Laplacian growth effect.

本文言語English
ページ(範囲)4025-4028
ページ数4
ジャーナルPhysical review letters
72
25
DOI
出版ステータスPublished - 1994
外部発表はい

ASJC Scopus subject areas

  • 物理学および天文学(全般)

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