Sound Reduction of Vibration Feedback by Perceptually Similar Modulation

Nan Cao, Hikaru Nagano, Masashi Konyo, Satoshi Tadokoro

研究成果: Conference contribution

抜粋

The transmission of high-frequency collision vibration can effectively deliver tactile characteristics in teleoperation of remote robots and the virtual environment. However, high-frequency vibrations also introduces audible noise. To address this issue, we modulated the frequency and amplitude of collision vibration to keep the perceptually similar while reducing the sound of the vibrations. Our experimental results showed that the sound pressure level of the collision vibrations (f = 675 Hz and 1012 Hz) is higher than the perceptual similar collision vibrations (f = 300 Hz and 450 Hz). These results suggest that our modulation method is able to reduce the sound level of the collision vibrations while maintaining the perceptual similarity.

元の言語English
ホスト出版物のタイトルRO-MAN 2018 - 27th IEEE International Symposium on Robot and Human Interactive Communication
出版者Institute of Electrical and Electronics Engineers Inc.
ページ934-939
ページ数6
ISBN(電子版)9781538679807
DOI
出版物ステータスPublished - 2018 11 6
イベント27th IEEE International Symposium on Robot and Human Interactive Communication, RO-MAN 2018 - Nanjing, China
継続期間: 2018 8 272018 8 31

出版物シリーズ

名前RO-MAN 2018 - 27th IEEE International Symposium on Robot and Human Interactive Communication

Other

Other27th IEEE International Symposium on Robot and Human Interactive Communication, RO-MAN 2018
China
Nanjing
期間18/8/2718/8/31

ASJC Scopus subject areas

  • Human-Computer Interaction
  • Cognitive Neuroscience
  • Communication
  • Artificial Intelligence

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  • これを引用

    Cao, N., Nagano, H., Konyo, M., & Tadokoro, S. (2018). Sound Reduction of Vibration Feedback by Perceptually Similar Modulation. : RO-MAN 2018 - 27th IEEE International Symposium on Robot and Human Interactive Communication (pp. 934-939). [8525571] (RO-MAN 2018 - 27th IEEE International Symposium on Robot and Human Interactive Communication). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ROMAN.2018.8525571