TY - JOUR
T1 - Solder-joint inspection using dry-contact ultrasonic device
AU - Tohmyoh, Hironori
AU - Saka, Masumi
PY - 2002/12/1
Y1 - 2002/12/1
N2 - A dry-contact ultrasonic device is developed for inspection of solder joints. The device nables us to inspect packages in a non-wetting manner by the aid of the interface formed by inserting a plastic film between water and the package. The jointing points in a wafer level package, which contained open circuit between the metal posts and the solder balls, was imaged by the device. The open points were detected clearly, and effective transmission of higher frequency ultrasound over the immersion device was achieved, where the inserted film performed as an acoustic matching layer. It was confirmed by both theoretical calculation and the experiment that the device realizes high lateral resolution similarly to the immersion one.
AB - A dry-contact ultrasonic device is developed for inspection of solder joints. The device nables us to inspect packages in a non-wetting manner by the aid of the interface formed by inserting a plastic film between water and the package. The jointing points in a wafer level package, which contained open circuit between the metal posts and the solder balls, was imaged by the device. The open points were detected clearly, and effective transmission of higher frequency ultrasound over the immersion device was achieved, where the inserted film performed as an acoustic matching layer. It was confirmed by both theoretical calculation and the experiment that the device realizes high lateral resolution similarly to the immersion one.
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M3 - Conference article
AN - SCOPUS:0036995211
VL - 1
SP - 819
EP - 822
JO - Proceedings - IEEE Ultrasonics Symposium
JF - Proceedings - IEEE Ultrasonics Symposium
SN - 1051-0117
T2 - 2002 IEEE Ultrasonics Symposium
Y2 - 8 October 2002 through 11 October 2002
ER -