Smaller surface acoustic wave duplexer for US personal communication service having good temperature characteristics

Takeshi Nakao, Michio Kadota, Kenji Nishiyama, Yasuharu Nakai, Daisuke Yamamoto, Yutaka Ishiura, Tomohisa Komura, Norihiko Takada, Ryoichi Kita

研究成果: Article査読

73 被引用数 (Scopus)

抄録

Using a flattened SiO2/Cu electrode/36-48° LiTaO3 structure, a small (5 × 5 mm2) surface acoustic wave (SAW) duplexer with a good temperature coefficient of frequency (TCF) for US personal communication services (PCS) was realized by the authors. However, a smaller duplexer is strongly required. Using the flip-chip bonding process of SAW chips and a Rayleigh SAW propagating on a flattened SiO2/CU electrode/1.26-1.28° YX-LiNbO3 structure, which has a larger coupling factor than the above-mentioned substrate, a smaller (3 × 2.5 mm2) SAW duplexer with a good TCF was realized.

本文言語English
ページ(範囲)4760-4763
ページ数4
ジャーナルJapanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers
46
7 B
DOI
出版ステータスPublished - 2007 7月 26
外部発表はい

ASJC Scopus subject areas

  • 工学(全般)
  • 物理学および天文学(全般)

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