Using a flattened SiO2/Cu electrode/36-48° LiTaO3 structure, a small (5 × 5 mm2) surface acoustic wave (SAW) duplexer with a good temperature coefficient of frequency (TCF) for US personal communication services (PCS) was realized by the authors. However, a smaller duplexer is strongly required. Using the flip-chip bonding process of SAW chips and a Rayleigh SAW propagating on a flattened SiO2/CU electrode/1.26-1.28° YX-LiNbO3 structure, which has a larger coupling factor than the above-mentioned substrate, a smaller (3 × 2.5 mm2) SAW duplexer with a good TCF was realized.
|ジャーナル||Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers|
|出版ステータス||Published - 2007 7月 26|
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