Small surface acoustic wave duplexer for wide-band code-division multiple access full-band system having good temperature characteristics

Michio Kadota, Takeshi Nakao, Kenji Nishiyama, Shunsuke Kido, Masanori Kato, Ryoichi Omote, Hiroshi Yonekura, Norihiko Takada, Ryoichi Kita

研究成果: Article査読

82 被引用数 (Scopus)

抄録

A small surface acoustic wave (SAW) duplexer for a wide-band code-division multiple access (W-CDMA) system with a good temperature coefficient of frequency (TCF) has been required. However, the conventional SAW duplexer for W-CDMA using Al electrode/50-70° YX-LiNbO3 is large (3.8 x 3.8 mm 2) and its TCF is not good (-80ppm/°C). When a SiO2 film is deposited on this substrate to improve its TCF, good frequency characteristics cannot be realized. Thus, by using a new structure such as a flattened SiO2 film/Cu electrode/substrate structure to improve the TCF, YX-LiNbO3 substrate to obtain a large coupling factor, and flip-chip bonding to miniaturize the duplexer, a small (3 x 2.5 mm2) SAW duplexer having a low insertion loss and a good TCF has been realized for the first time.

本文言語English
ページ(範囲)4714-4717
ページ数4
ジャーナルJapanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers
46
7 B
DOI
出版ステータスPublished - 2007 7月 26
外部発表はい

ASJC Scopus subject areas

  • 工学(全般)
  • 物理学および天文学(全般)

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