Skin effect suppressed NiFe/Cu electroplated multilayer wiring for high data-rate and low delay-time I/O interface board

M. Yamaguchi, T. Yanai, H. Nakayama, R. Sai, H. Fujiwara, Y. Kitai, M. Sato, U. Sangawa

研究成果: Conference contribution

抄録

This paper proposes a new application of skin effect suppression technology [1]-[4] for long wiring on high-speed & low-delay I/O board (typical wiring length; 200 to 1000 mm). This proposal will overcome the difficulty to further reduce the transmission losses on the I/O board with >50 Gbps data rate, which is currently performed by lowering dielectric substrate losses and surface smoothing of Cu conductor. A major challenge in this paper is to demonstrate the skin effect suppression by electroplated magnetic/conductor multilayer, instead of sputter-deposited thin film in literature [2]-[4], in order to meet coming cost-effective, thick (>5 μm), large area, and high throughput mass productivity requirements. High frequency (>10 GHz) estimation of complex permeability and measurements of low resistance devices are also investigated.

本文言語English
ホスト出版物のタイトル2018 IEEE International Magnetic Conference, INTERMAG 2018
出版社Institute of Electrical and Electronics Engineers Inc.
ISBN(電子版)9781538664254
DOI
出版ステータスPublished - 2018 10 24
イベント2018 IEEE International Magnetic Conference, INTERMAG 2018 - Singapore, Singapore
継続期間: 2018 4 232018 4 27

出版物シリーズ

名前2018 IEEE International Magnetic Conference, INTERMAG 2018

Other

Other2018 IEEE International Magnetic Conference, INTERMAG 2018
CountrySingapore
CitySingapore
Period18/4/2318/4/27

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Instrumentation

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