Skin Effect Suppressed Ni-Fe/Cu Electroplated Multilayer Wiring for High Data-Rate and Low Delay-Time I/O Interface Board

Masahiro Yamaguchi, Takeshi Yanai, Hidetoshi Nakayama, Ranajit Sai, Hiroaki Fujiwara, Yuki Kitai, Mikio Sato, Ushio Sangawa

研究成果: Article査読

2 被引用数 (Scopus)

抄録

Application of negative permeability beyond ferromagnetic resonance frequency is discussed in this paper. Targeted application is the skin effect suppression technology for long wiring on high-speed and low-delay I/O board. An 11.9 μ m-thick Ni-Fe/Cu multilayer consisting of 0.25 μ m-thick Ni-Fe and 0.51 μ m-thick Cu in turn was electroplated, patterned into 609 μ m-wide and 40 mm-long signal line of microstrip line (MSL) on a 250 μ m-thick printed circuit board. Targeted frequency was 15 GHz, where relative real part permeability was supposed to be-2. The 40 mm-long Ni-Fe/Cu multilayer exhibited the insertion as small as 0.7 dB up to 25 GHz, which is almost the same as the copper monolayer MSL of the same geometry.

本文言語English
論文番号8458383
ジャーナルIEEE Transactions on Magnetics
54
11
DOI
出版ステータスPublished - 2018 11
外部発表はい

ASJC Scopus subject areas

  • 電子材料、光学材料、および磁性材料
  • 電子工学および電気工学

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