Sintered Ferrite Thin Plate Noise Suppressor Mounted on IC Chip Interposer

Masahiro Yamaguchi, Akihiro Takahashi, Yasunori Miyazawa, Koh Watanabe, Kosuke Jike, Satoshi Tanaka, Noriyuki Miura, Makoto Nagata

研究成果: Conference contribution

抄録

NiCuZn spinel ferrite particles were sintered into 50 m-thick plate and mounted in between IC die and its interposer to explore their suitability as electromagnetic noise suppressor up to 10 GHz. A 50 m thick Y-Type hexaferrite plate with density of 5.2 g/cm3 exhibits the figure-of-merit, Ploss/Pin, as high as 0.27 at 7 GHz. The test ferrite plate was embedded in between IC chip and interposer using a newly developed pre-assembly technique. This was enough to suppress on-chip conduction noise and corresponding near field emission by 4-17 dB in wireless communication channels.

本文言語English
ホスト出版物のタイトルEMC COMPO 2019 - 2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits
出版社Institute of Electrical and Electronics Engineers Inc.
ページ231-233
ページ数3
ISBN(電子版)9781728142616
DOI
出版ステータスPublished - 2019 10
イベント12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits, EMC COMPO 2019 - Haining, Hangzhou, China
継続期間: 2019 10 212019 10 23

出版物シリーズ

名前EMC COMPO 2019 - 2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits

Conference

Conference12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits, EMC COMPO 2019
CountryChina
CityHaining, Hangzhou
Period19/10/2119/10/23

ASJC Scopus subject areas

  • Instrumentation
  • Electrical and Electronic Engineering
  • Safety, Risk, Reliability and Quality
  • Radiation

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