In the fabrication of single-electron (SE) devices with gold nanoparticles (GNPs), one of the technical challenges is the arrangement of GNPs into a gap between electrodes. We employed dielectrophoresis (DEP) for the GNP arrangement because it allowed flexible fabrication conditions. When we tried to arrange GNPs into a gap between electrodes, we often had an excessive current during DEP, which resulted in poor fabrication yields. It suggested that the Joule heat generated by the excessive current could break or fused arrays of GNPs when the electrodes were bridged through the arrays. In order to solve this problem, we coated the electrode surfaces with a self-assembled monolayer (SAM) of dithiol, by which high resistance between GNPs and electrodes was realized. That is, suppression of excess currents and improvement of fabrication yield were confirmed. We also demonstrated that a sample device fabricated by using this method exhibited not only the Coulomb blockade but also the Coulomb oscillation.