Silicon micromachining for integrated microsystems

M. Esashi

研究成果: Article査読

16 被引用数 (Scopus)

抄録

Small sized but relatively complicated intelligent systems or subsystems were fabricated based on silicon micromachining. Packaged micromechanical sensors as extremely sensitive resonant sensors, accelerometers and a silicon diaphragm capacitive vacuum sensor were developed. A two-dimensional electromagnetic optical scanner was also developed. The vacuum pressures in the packaged cavities of these devices were well controlled. Microflow control systems which have bakable microvalves were fabricated for advanced semiconductor processes. Novel three-dimensional microfabrication methods were developed for silicon micromachining.

本文言語English
ページ(範囲)469-474
ページ数6
ジャーナルVacuum
47
6-8
出版ステータスPublished - 1996
外部発表はい

ASJC Scopus subject areas

  • 器械工学
  • 凝縮系物理学
  • 表面、皮膜および薄膜

フィンガープリント

「Silicon micromachining for integrated microsystems」の研究トピックを掘り下げます。これらがまとまってユニークなフィンガープリントを構成します。

引用スタイル