Small sized but relatively complicated intelligent systems or subsystems were fabricated based on silicon micromachining. Packaged micromechanical sensors as extremely sensitive resonant sensors, accelerometers and a silicon diaphragm capacitive vacuum sensor were developed. A two-dimensional electromagnetic optical scanner was also developed. The vacuum pressures in the packaged cavities of these devices were well controlled. Microflow control systems which have bakable microvalves were fabricated for advanced semiconductor processes. Novel three-dimensional microfabrication methods were developed for silicon micromachining.
|出版ステータス||Published - 1996|
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