@inproceedings{a84636d9d9bf4d90b8802c8d00e37fac,
title = "Self-assembly based multichip-to-wafer bonding technologies for 3D/hetero integration",
abstract = "We have proposed and developed 3D integration technologies based on self-assembly using surface tension of liquid in this decade. In this paper, microbump bonding and bumpless bonding in face-up and/or face-down configuration are introduced for finepitch interconnect formation. In addition, {"}non-transfer stacking{"}, in other word, flip-chip self-assembly and {"}transfer stacking{"} called reconfigure-wafer-to-wafer using SAE carrier are explained.",
author = "T. Fukushima and Lee, {K. W.} and T. Tanaka and M. Koyanagi",
year = "2016",
month = jan,
day = "1",
doi = "10.1149/07509.0285ecst",
language = "English",
series = "ECS Transactions",
publisher = "Electrochemical Society Inc.",
number = "9",
pages = "285--290",
editor = "R. Knechtel and F. Fournel and Hobart, {K. D.} and T. Suga and H. Baumgart and Tan, {C. S.} and Goorsky, {M. S.}",
booktitle = "Semiconductor Wafer Bonding",
edition = "9",
note = "Symposium on Semiconductor Wafer Bonding: Science, Technology and Applications 14 - PRiME 2016/230th ECS Meeting ; Conference date: 02-10-2016 Through 07-10-2016",
}