Self-assembly based multichip-to-wafer bonding technologies for 3D/hetero integration

T. Fukushima, K. W. Lee, T. Tanaka, M. Koyanagi

研究成果: Conference contribution

抄録

We have proposed and developed 3D integration technologies based on self-assembly using surface tension of liquid in this decade. In this paper, microbump bonding and bumpless bonding in face-up and/or face-down configuration are introduced for finepitch interconnect formation. In addition, "non-transfer stacking", in other word, flip-chip self-assembly and "transfer stacking" called reconfigure-wafer-to-wafer using SAE carrier are explained.

本文言語English
ホスト出版物のタイトルSemiconductor Wafer Bonding
ホスト出版物のサブタイトルScience, Technology and Applications 14
編集者R. Knechtel, F. Fournel, K. D. Hobart, T. Suga, H. Baumgart, C. S. Tan, M. S. Goorsky
出版社Electrochemical Society Inc.
ページ285-290
ページ数6
9
ISBN(電子版)9781607685395
DOI
出版ステータスPublished - 2016 1 1
イベントSymposium on Semiconductor Wafer Bonding: Science, Technology and Applications 14 - PRiME 2016/230th ECS Meeting - Honolulu, United States
継続期間: 2016 10 22016 10 7

出版物シリーズ

名前ECS Transactions
番号9
75
ISSN(印刷版)1938-5862
ISSN(電子版)1938-6737

Other

OtherSymposium on Semiconductor Wafer Bonding: Science, Technology and Applications 14 - PRiME 2016/230th ECS Meeting
CountryUnited States
CityHonolulu
Period16/10/216/10/7

ASJC Scopus subject areas

  • Engineering(all)

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