1 被引用数 (Scopus)

抄録

In order to improve assembly throughput and production yield in chip-on-wafer 3D integration, surface tension-driven chip self-assembly technologies have been proposed. Small volume of liquid droplets can precisely assemble a large number of known good dies on host wafers at the sub-micrometer accuracy level. Here, impact of several parameters on alignment accuracies are described. In addition, this chapter introduces interconnect technologies of self-assembled chips in a face-up or face-down bonding fashion to the host wafers with metal microbumps.

本文言語English
ホスト出版物のタイトル3D Process Technology
出版社Wiley-Blackwell
ページ325-334
ページ数10
3
ISBN(電子版)9783527670109
ISBN(印刷版)9783527334667
DOI
出版ステータスPublished - 2014 7月 21

ASJC Scopus subject areas

  • 工学(全般)
  • 生化学、遺伝学、分子生物学(全般)
  • 化学工学(全般)
  • 材料科学(全般)

フィンガープリント

「Self-Assembly Based 3D and Heterointegration」の研究トピックを掘り下げます。これらがまとまってユニークなフィンガープリントを構成します。

引用スタイル