Room temperature bonding of sapphire with sapphire or metal substrates in Air using Au films

M. Ishii; H. Kon; M. Uomoto; T. Nakaya; T. Shimatsu

doi:10.1109/LTB-3D.2014.6886166

Room temperature bonding of sapphire with sapphire or metal substrates in Air using Au films

M. Ishii, H. Kon, M. Uomoto, T. Nakaya, T. Shimatsu

学際科学フロンティア研究所・先端学際基幹研究部

研究成果: Conference contribution

4 被引用数 (Scopus)

抄録

Room temperature bonding of sapphire-sapphire and sapphire-metal substrates was achieved in Air using Au films. This bonding technique can support expansion of the potential applications of sapphire in diverse industries.

本文言語	English
ホスト出版物のタイトル	Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014
出版社	IEEE Computer Society
ページ数	1
ISBN（印刷版）	9781479952618
DOI	https://doi.org/10.1109/LTB-3D.2014.6886166
出版ステータス	Published - 2014 1 1
イベント	2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014 - Tokyo, Japan 継続期間: 2014 7 15 → 2014 7 16

出版物シリーズ

名前	Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014

Other

Other	2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014
Country	Japan
City	Tokyo
Period	14/7/15 → 14/7/16

ASJC Scopus subject areas

Filtration and Separation

文献へのアクセス

10.1109/LTB-3D.2014.6886166

フィンガープリント「Room temperature bonding of sapphire with sapphire or metal substrates in Air using Au films」の研究トピックを掘り下げます。これらがまとまってユニークなフィンガープリントを構成します。

引用スタイル

Ishii, M., Kon, H., Uomoto, M., Nakaya, T., & Shimatsu, T. (2014). Room temperature bonding of sapphire with sapphire or metal substrates in Air using Au films. In Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014 [6886166] (Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014). IEEE Computer Society. https://doi.org/10.1109/LTB-3D.2014.6886166

Room temperature bonding of sapphire with sapphire or metal substrates in Air using Au films. / Ishii, M.; Kon, H.; Uomoto, M.; Nakaya, T.; Shimatsu, T.

Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014. IEEE Computer Society, 2014. 6886166 (Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014).

研究成果: Conference contribution

Ishii, M, Kon, H, Uomoto, M, Nakaya, T & Shimatsu, T 2014, Room temperature bonding of sapphire with sapphire or metal substrates in Air using Au films. in Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014., 6886166, Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014, IEEE Computer Society, 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014, Tokyo, Japan, 14/7/15. https://doi.org/10.1109/LTB-3D.2014.6886166

Ishii M, Kon H, Uomoto M, Nakaya T, Shimatsu T. Room temperature bonding of sapphire with sapphire or metal substrates in Air using Au films. In Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014. IEEE Computer Society. 2014. 6886166. (Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014). https://doi.org/10.1109/LTB-3D.2014.6886166

Ishii, M. ; Kon, H. ; Uomoto, M. ; Nakaya, T. ; Shimatsu, T. / Room temperature bonding of sapphire with sapphire or metal substrates in Air using Au films. Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014. IEEE Computer Society, 2014. (Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014).

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