RIE of solenoidal microcoil glass mould with integrated sample container for Micro-MRI

Mona J K Klein, Takahito Ono, Masayoshi Esashi, J. G. Korvink

研究成果: Conference contribution

3 被引用数 (Scopus)

抄録

We report the fabrication of a solenoidal microcoil mould structure based on reactive ion etching (RIE) of 100 μm thick borosilicate glass wafers. For magnetic resonance imaging (MRI), glass has superior properties compared to silicon, e.g. the lower dielectric constant and transparency. Double-side polished substrates are pre-etched in a two step process, and then anodically bonded together to achieve a hollow structure inside the coil to serve as a sample container. Two additional etch steps that are each performed on the top and bottom surfaces of the bonded wafers complete the solenoidal coil mould structure.

本文言語English
ホスト出版物のタイトルProceedings - CIS Workshops 2007, 2007 International Conference on Computational Intelligence and Security Workshops, CISW 2007
ページ345-348
ページ数4
出版ステータスPublished - 2007 12 1
イベント20th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2007 - Kobe, Japan
継続期間: 2007 1 212007 1 25

Other

Other20th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2007
CountryJapan
CityKobe
Period07/1/2107/1/25

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Mechanical Engineering
  • Condensed Matter Physics
  • Electronic, Optical and Magnetic Materials

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