Resonance-free HRS MEMS package for microwave and millimeter-wave

Yo Tak Song, Takahito Ono, Hai Young Lee, Masayoshi Esashi

研究成果: Conference contribution

1 被引用数 (Scopus)

抄録

A silicon (Si) micro electro mechanical system (MEMS) package using a lightly-doped Si chip carrier for coplanar waveguide (CPW) microwave and millimeter-wave integrated circuits (MMICs) is proposed in order to reduce parasitic problems of leakage, coupling, and resonance. The proposed chip carrier scheme is verified by fabricating and measuring a high resistivity silicon (MRS, 10 kΩ·cm) CPW on three types of carriers (conductor-back metal, lightly-doped Si, and HRS) in the frequency range 0.5 to 40 GHz. The proposed MEMS package using the lightly-doped (15 Ω·cm) Si chip carrier and the HRS shows the low loss and resonance-free since the lightly-doped Si chip carrier effectively absorbs and suppresses the resonant leakage. The Si MEMS package for CPW MMICs has an insertion loss (S 21) of 2.0 dB, a reflection loss (S 11) of 10 dB, and a power loss (PL) of 6.0 dB up to 40 GHz.

本文言語English
ホスト出版物のタイトルTRANSDUCERS '05 - 13th International Conference on Solid-State Sensors and Actuators and Microsystems - Digest of Technical Papers
ページ427-432
ページ数6
1
出版ステータスPublished - 2005 11 9
イベント13th International Conference on Solid-State Sensors and Actuators and Microsystems, TRANSDUCERS '05 - Seoul, Korea, Republic of
継続期間: 2005 6 52005 6 9

Other

Other13th International Conference on Solid-State Sensors and Actuators and Microsystems, TRANSDUCERS '05
CountryKorea, Republic of
CitySeoul
Period05/6/505/6/9

ASJC Scopus subject areas

  • Engineering(all)

フィンガープリント 「Resonance-free HRS MEMS package for microwave and millimeter-wave」の研究トピックを掘り下げます。これらがまとまってユニークなフィンガープリントを構成します。

引用スタイル