Recovery of silicon powder from silicon wiresawing slurries by tuning the particle surface potential combined with centrifugation

Suning Liu, Kai Huang, Hongmin Zhu

研究成果: Article査読

25 被引用数 (Scopus)

抄録

A novel recovery process for effective separation of silicon and silicon carbide micropowders from the wiresawing slurry was proposed, based on the difference in their size and surface charging state. The surface charging levels of silicon and silicon carbide particles were found to be obviously different by tuning the solution pH values, so the pre-dispersed mixed particles in the suspension will be subject to different static electrical repulsion and particle mass. Under the same centrifugation filed, Si and SiC particles will have distinctly different separation tendency. Experimental results show that the silicon microparticles tend to suspend in the upper part of the vessels whereas the silicon carbide particles will settle down to the bottom quickly, leading to the effective separation of above powders. The optimal results show that Si content can reach 91.8% in the Si-rich powder and 4.8% in the SiC-rich powder by separating the mixed powder with Si 24.9% and SiC 70.1% as the raw material.

本文言語English
ページ(範囲)448-454
ページ数7
ジャーナルSeparation and Purification Technology
118
DOI
出版ステータスPublished - 2013
外部発表はい

ASJC Scopus subject areas

  • 分析化学
  • ろ過および分離

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