Results are presented for a three-dimensional finite-element method simulation of a head/medium model for 1 Tb/in2 (540 ktpi with 38-nm track width and 47-nm track pitch, 1.8 Mbpi with minimum bit length of 11 nm). We have simultaneously introduced three new structures, side shields, tapered main pole, and tapered return path for the head in order to satisfy the requirement for a large recording field, small stray field to the adjacent tracks, and a field distribution that is robust for skew problems, which are all indispensable for higher linear and track density recording.
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering